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Micropac Industries, Inc. offers over 40 years of experience in the manufacturing of multichip microelectronics modules. We have supplied single component and multi component devices for military, space, medical and hi-rel industrial applications. Micropac has ISO / AS 9100 registered facilities that are qualified to MIL-PRF 38534, Class K and MIL-PRF-19500 JANS. Micropac can support High Mix / Low Mix volume contract manufacturing services and can provide services tailored to meet the customers unique electronics packaging requirements. We can provide electronics packaging solutions throughout the customers product life cycle that will meet or exceed the customers expectations. Micropac provides Program Management and Manufacturing Resources for each customer application. We will work at the component level or the assembly level. Micropac will provide complete microcircuit outsourcing services for customers who are interested in microcircuit fabrication outsourcing.

厂商官网:http://www.micropac.com/templa

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